Lau, John H.  <br/><br/>
Semiconductor Advanced Packaging 
John H. Lau 
 -  Springer,  2021 
<br/><br/><label>ISBN: </label>9789811613760 9789811613753 
<br/><br/><label>Subjects--Topical Terms: </label><br/>SCIENCE / Physics / Condensed Matter<br/>TECHNOLOGY & ENGINEERING / Electronics / Semiconductors