Lau, John H. <br/><br/>
Semiconductor advanced packaging / 
John H. Lau 
 - Singapore :  Springer Nature Singapore Pte Ltd.,  2021. 
 - xxii, 498 p. :  ill. (col.) ;  24 cm. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>9789811613784 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductor packaging.<br/>Semiconductor devices.<br/>Microelectronics.<br/>Integrated circuits--Packaging.
<br/><br/><label>LC Class. No.: </label>TK7874  / .L38 2021 
<br/><br/><label>Dewey Class. No.: </label>621.381046  / /LAU