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1.
Inside SPICE / Ron M. Kielkowski. by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York : McGraw-Hill, c1998
Online access:
Availability: Items available for loan: Dato Maznah Library & Information Services (1)Location, call number: T Technology (General) TK454.K47 1998.

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2.
SPICE for power electronics and electric power / Muhammad H. Rashid. by
Edition: 3rd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: Boca Raton, FL : CRC Press, c2012
Availability: Items available for loan: Dato Maznah Library & Information Services (1)Location, call number: T Technology (General) TK7881.15.R38 2012.

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