000 01295cam a2200325 a 4500
001 2145509
003 OSt
005 20241224092156.0
008 980715s1998 nyua 000 0 eng
010 _a 98065029
_z 98163137
020 _a0079137121 (alk. paper)
020 _a9780079137128
040 _aDLC
_cDLC
_dDLC
050 0 0 _aTK454
_b.K47 1998
100 1 _aKielkowski, Ron M.
245 1 0 _aInside SPICE /
_cRon M. Kielkowski.
250 _a2nd ed.
260 _aNew York :
_bMcGraw-Hill,
_cc1998.
300 _axv, 200 p. :
_bill. ;
_c24 cm. +
_e1 computer laser optical disc (4 3/4 in.).
440 0 _aElectronic packaging and interconnection series
504 _aIncludes bibliographical references and index.
630 0 0 _aSPICE (Computer file)
650 0 _aElectric circuits
_xComputer simulation.
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/description/mh023/98065029.html
856 4 1 _3Table of contents
_uhttp://www.loc.gov/catdir/toc/mh022/98065029.html
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/enhancements/fy0705/98065029-b.html
906 _a7
_bcbc
_corignew
_d2
_eopcn
_f19
_gy-gencatlg
942 _2lcc
_cBOOKS
_n0
999 _c1085
_d1085