| 000 | 00652nam a22001937a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20250825102001.0 | ||
| 008 | 250825b |||||||| |||| 00| 0 eng d | ||
| 020 | _a9789811613760 | ||
| 020 | _a9789811613753 | ||
| 040 | _cMLIS | ||
| 100 | _aLau, John H. | ||
| 245 |
_aSemiconductor Advanced Packaging _cJohn H. Lau |
||
| 260 |
_bSpringer, _c2021 |
||
| 650 | _aSCIENCE / Physics / Condensed Matter | ||
| 650 | _aTECHNOLOGY & ENGINEERING / Electronics / Semiconductors | ||
| 856 |
_uhttps://ebookcentral-proquest-com.mlisicats.remotexs.co/lib/ppks/detail.action?docID=6627540&query=9789811613760 _zClick to view |
||
| 942 |
_2lcc _cEB _n0 |
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| 999 |
_c1970 _d1970 |
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