| 000 | 00770nam a2200241 a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20251224103446.0 | ||
| 008 | 251224b |||||||| |||| 00| 0 eng d | ||
| 020 | _a9789811613784 | ||
| 040 |
_aDLC _beng _cDLC _dICATSUC |
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| 050 |
_aTK7874 _b.L38 2021 |
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| 082 |
_a621.381046 _b/LAU |
||
| 100 |
_aLau, John H. _eauthor. |
||
| 245 |
_aSemiconductor advanced packaging / _cJohn H. Lau |
||
| 260 |
_aSingapore : _bSpringer Nature Singapore Pte Ltd., _c2021. |
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| 300 |
_axxii, 498 p. : _bill. (col.) ; _c24 cm. |
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| 504 | _aIncludes bibliographical references and index. | ||
| 650 | _aSemiconductor packaging. | ||
| 650 | _aSemiconductor devices. | ||
| 650 | _aMicroelectronics. | ||
| 650 |
_aIntegrated circuits _xPackaging. |
||
| 942 |
_2lcc _cBOOKS _n0 |
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| 999 |
_c2154 _d2154 |
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